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8 inch polycrystalline silicon wafer |
Details: |
1 |
appearance |
Quasi square chamfer |
visual |
2 |
thickness
Average thickness |
200 ± 20 μm
200 ± 5 μm |
Sorting machine |
3 |
TTV |
≦25.0 μm |
Sorting machine |
4 |
The length (on the margins) |
156.0 ± 0.3 mm |
ruler |
5 |
diameter |
219.0± 1.0 mm |
ruler |
6 |
Chamfer |
1.5± 0.5 mm |
Film ruler |
7 |
bevel angle |
45゚± 10゚ |
angle square |
8 |
Right angle |
90゚± 0.2゚ |
angle square |
9 |
Line |
≦ 10 μm |
Sorting machine, roughness tester |
10 |
Edge defect |
不允许 |
visual |
11 |
V type gap |
不允许 |
visual |
12 |
Warp degree
Bending degree |
≦ 50.0 μm
≦ 40.0μm |
Feeler, sorting machine |
13 |
Surface condition |
No visible impurities, dirt, cracks, perforation;
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visual | |
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